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Metalens 5G Smartphone
5G Smartphone with Metalens
MetaOptics’ 5G Smartphone showcases how metalenses can completely redefine the mobile camera stack. The device features an ultra thin metalens optical module that removes the traditional camera bump, enabling a clean, seamless back cover while maintaining high quality imaging performance. The glass based metalens architecture is engineered for high thermal stability, making it suitable for intensive 5G and edge processing workloads.

Metalens Integration In A Flagship 5G Device

Beyond imaging, the Smartphone debuts a breakthrough non contact metalens 3D biometric fingerprint module. This module captures a high resolution 3D fingerprint map through the display, enabling secure, touch free authentication and a smoother, more hygienic user experience. The platform is powered by the Qualcomm Dragonwing QCM6490, a robust processor optimised for IoT ready devices that require premium tier performance across multiple operating systems.

  • Ultra thin metalens camera stack with no camera bump
  • Glass based, heat resistant metalens design
  • Non contact 3D fingerprint module for touch free biometrics
  • High quality imaging and sensing in a compact module
  • Qualcomm Dragonwing QCM6490 platform for 5G and IoT use cases
  • Designed as a reference platform for OEM metalens integration

Ultra thin
metalens camera,

Flat metalens optics deliver a clean back design
without compromising image quality.

3d fingerprint
security

Metalens 3D biometric module captures a high
resolution fingerprint mapthrough the display for
touch free unlock.

Step into the future with metalens

An ultra-thin metalens camera stack removes the traditional bump, while a non-contact 3D fingerprint module unlocks through the display. Powered by the Qualcomm Dragonwing QCM6490 for 5G and edge workloads.

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