Logo

Photonics
Integration

Co-packaged metaoptics for compact photonic systems.

Metalens-enabled co-packaged optical components for data-centre interconnects, quantum-photonics platforms and dense sensing modules. Replace free-space alignment with lithographically defined components.

Flat optics for data
transfer

Flat metaoptics for moving data as light. Light carries information faster and more efficiently, and a flat optic couples and shapes that signal in a single layer.

Alignment made simple

Alignment made simple

A flat, patterned metaoptics substrate aligns far more simply than a stack of conventional optics. Fewer elements to register means tighter alignment, a smaller footprint, and a more robust package.

Co-packaged optics

Co-packaged optics

Metalens and device in one package.

Learn more

Integration at a glance

01

Lithographic alignment

Fixed positioning defined in fabrication.

Lithographic alignment
02

Compact form factor

Module footprint driven by die area.

Compact form factor
03

Configurable spectral response

Wavelength behaviour designed into the optic.

Configurable spectral response
04

Interconnect ready

Suited to dense optical I/O modules.

Interconnect ready
05

Integrated sensing

Compact spectrometer and imaging modules.

Integrated sensing
Talk to our foundry team
Talk to our team

Talk to our
foundry team

Have a device you want to integrate a metalens with? Tell us about it.

Contact us

Connect with us

Singapore (HQ)

Metaoptics Technologies Pte Ltd. 81 Ayer Rajah Crescent, #01-45 Singapore 139967

United States

Metaoptics Inc. (USA); 1 Ferry Building, Suite 201 San Francisco, CA 94111

Metaoptics Technologies Pte Ltd. All rights reserved
Site by TDCreatives.asia