Ultra-compact, precision-engineered metalens components that solve the most critical optical challenges inside modern CPO packages, enabling tighter integration, higher bandwidth, and long-term reliability.
Bringing Optics and Electronics Closer Together
Co-Packaged Optics (CPO) combine electrical and optical functions in ultra-compact packages, boosting bandwidth, energy efficiency, and signal quality for data centers and AI infrastructures.
As CPO becomes the backbone of next-generation compute networks, the optics inside these packages need to be just as advanced. MetaOptics metalens technology is built for exactly this challenge.
CPO defines where optics are needed. Metalens define how light is efficiently delivered.
MetaOptics has successfully prototyped a 127µm diameter co-packaged optical component, setting new standards for miniaturization and scalability, and positioning the company as a leader in next-gen optical interconnects.
CPO introduces some of the most demanding requirements in modern photonics. MetaOptics metalens technology is engineered to address each of them directly.
Hundreds of fibers must connect to the chip with sub-micron precision. Misalignment reduces bandwidth and efficiency.
Metalens focuses and steers light precisely, allowing simpler, passive alignment.
Optics are inside tight CPO packages, making traditional bulky components impractical.
Ultra-thin, planar design fits compactly, enabling high-density integration.
High power chips generate heat; bulky optics or moving parts are vulnerable to deformation and failure.
Solid-state, robust optics survive heat and stress, improving reliability.
Traditional micro-optics rely on curved, three-dimensional lens geometries, physically thick components that were designed for an era when space constraints were less demanding. In the tight confines of a CPO package, their bulky form factor limits integration density, makes precise alignment harder to maintain at scale, and leaves them vulnerable to thermal deformation under the heat generated by high-power chips.
The difference is visible. Where traditional micro-optics produce a wide, diffuse beam with poor focus consistency, MetaOptics metalens delivers a tightly concentrated, high-precision beam profile.
| Feature | Traditional Micro-optics | Metaoptics Metalens |
|---|---|---|
| Form Factor | Thick, Curved, 3D Geometry | Ultra-Thin, Planar, Flat Profile |
| Beam Quality | Wide, Diffuse Beam | Tightly Focused, Precision Beam |
| Alignment | Requires Active Mechanical Adjustment | Enables Passive Alignment |
| Packaging Fit | Bulky, Limits Integration Density | Compact, Ideal For High-Density CPO |
| Thermal Resilience | Vulnerable To Deformation Under Heat | Solid-State, Thermally Stable |
| Manufacturing | Custom Fabrication, Complex Assembly | Wafer-Level, Semiconductor-Compatible |
| Scalability | Difficult To Scale For High-Volume | Designed For High-Throughput Production |
Connect with us
Singapore (HQ)
Metaoptics Technologies Pte Ltd. 81 Ayer Rajah Crescent, #01-45 Singapore 139967
United States
Metaoptics Inc. (USA); 1 Ferry Building, Suite 201 San Francisco, CA 94111
